Thermosetting resin composition, thermosetting resin composition for fiber-reinforced composite material, prepared using the same, and honeycomb sandwich panel
US9074091B2 · kind B2 · utility
3Cited by
3References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2010 |
| Grant date | Jul 7, 2015 |
| Priority date | — |
| Expiry date | Jan 18, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2933
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An object of the present invention is to provide a thermosetting resin composition having superior toughness. The thermosetting resin composition of the present invention includes a thermosetting resin, and an adsorbing filler in which a thermoplastic resin C is adsorbed on a filler, wherein an adsorption coefficient that is greater than 0 and less than or equal to 0.8, defined by Formula 1 is satisfied. Formula 1: Adsorption coefficient={Amount (parts by mass) of the thermoplastic resin C adsorbed on 100 parts by mass of the filler/specific gravity of the thermoplastic resin C}/DBP oil absorption (mL/100 g) of the filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.