Patent · US Active

Potting compound suitable for potting an electronic component

US9074108B2 · kind B2 · utility

0Cited by

18References

22Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Jürgen Huber · Erlangen, DE
Lothar Schön · Neunkirchen, DE
Matthias Übler · Ursensollen, DE

Key dates

Filing date	May 13, 2011
Grant date	Jul 7, 2015
Priority date	—
Expiry date	May 13, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01F41/127
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

The invention relates to a potting compound suitable for potting an electronic component, in particular a large-volume coil such as a gradient coil, consisting of a supporting matrix in which at least one filler made of polymer nanoparticles is distributed. At least one filler (11) that is used as a flame retardant is introduced into the supporting matrix (8).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.