Assembly structure for injection molded substrate and for mounting component
US9078358B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 18, 2012 |
| Grant date | Jul 7, 2015 |
| Priority date | — |
| Expiry date | Nov 25, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09072
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate (1) includes conductive portions (7) formed by press working and a resin portion (11) integrally injection-molded with the conductive portions (7). The conductive portions (7) are formed from, for example, a copper alloy. The resin portion 11 is formed from, for example, PPS. A surface-mount component (3), which is an electronic surface-mount component, is mounted on the substrate (1). The surface-mount component (3) has electrodes (5) at its opposite sides, and the electrodes (5) and the respective conductive portions (7) are electrically connected by means of a solder (9). The substrate (1) has a hole (13), which functions as a stress relaxation mechanism, formed in the resin portion (11) (a portion extending therethrough) between connection portions (15) under the surface-mount component (3). The substrate (1) also has resin-exposed portions (13), which function as a stress relaxation mechanism, formed on opposite sides of the surface-mount component (3).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.