Heat emission device for junction box printed circuit board
US9078378B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 8, 2012 |
| Grant date | Jul 7, 2015 |
| Priority date | — |
| Expiry date | Jul 17, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a heat emission/radiation device for a junction box printed circuit board (PCB), which allows a next-generation intelligent junction box PCB to be manufactured in a dual-layer structure that maximizes heat emission effects. In other words, the present invention provides a heat emission device for a junction box PCB, in which a PCB having an IPS semiconductor device mounted thereon is mounted as a dual-layer structure by folding, such that the PCB may be easily installed in a small space of a vehicle, and a heat absorption and emission path for effectively emitting heat generated by the PCB mounted as the dual-layer structure is formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.