Thermoplastic resin composition having improved thermal conductivity and articles thereof
US9080039B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2012 |
| Grant date | Jul 14, 2015 |
| Priority date | — |
| Expiry date | Jul 10, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/005
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermoplastic resin composition comprises (A) about 30 to about 50% by weight of a thermoplastic resin, and (B) about 50 to about 70% by weight of a spherical magnesium oxide, wherein the thermal diffusivity of the thermoplastic resin composition in the horizontal or vertical direction is about 0.065 to about 0.20 cm2/sec and the ratio of thermal diffusivity of the horizontal direction:vertical direction is about 1:0.5 to about 1:1. A thermoplastic resin composition according to a second embodiment comprises (A) about 30 to about 50% by weight of a thermoplastic resin, and (B) about 50 to about 70% by weight of a spherical magnesium oxide, wherein the spherical magnesium oxide is treated on its surface with a silane compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.