Reduction in modulus of polyurethane sealants and adhesives
US9080087B2 · kind B2 · utility
5Cited by
3References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2011 |
| Grant date | Jul 14, 2015 |
| Priority date | — |
| Expiry date | Dec 3, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/26
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Low modulus, polyurethane sealant or adhesive compositions and a method of reducing the modulus of a polyurethane sealant or adhesive composition, including adding a modulus reducing additive of at least one of rosin esters, hydrogenated rosin esters, or mixtures thereof, to a sealant or adhesive composition including a polyurethane prepolymer, optionally having a bio-based content of from about 15% to about 75% by weight.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.