Computer-implemented composite simulation method and non-transitory computer medium for use in molding process
US9081923B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2014 |
| Grant date | Jul 14, 2015 |
| Priority date | — |
| Expiry date | Aug 14, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2111/10
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A computer-implemented method for use in a molding process by a computer processor includes specifying a simulating domain having a cavity part and a runner part; setting a filling condition of the cavity part without taking into consideration the runner part, wherein the filling condition includes gate pressures and filling rates of the cavities of the cavity part; and performing a steady state analysis to calculate flow conditions of a plurality of runner designs for the runner part by taking into consideration the filling condition of the cavity part, wherein the flow conditions include flow rates of a molding material in the runners of the runner part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.