Method for interconnecting a conductive pad and an electrical contact via a spring, and corresponding device
US9082061B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2011 |
| Grant date | Jul 14, 2015 |
| Priority date | — |
| Expiry date | Jun 29, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A device having an integrated-circuit chip includes an insulating body containing at least one conductive pad, at least one electrical contact opposite the electrically conductive pad, and at least one recess in the body, including a bottom and one aperture. The recess is connected, at the bottom thereof, to the conductive pad and, at the aperture thereof, to the electrical contact. At least one coil spring is arranged in the recess and connecting the conductive pad to the electrical contact. The installation of the spring in the recess is facilitated by means of the friction of the central portion of the spring relative to the walls of the recess. The invention also relates to a method for producing an electrical connection between at least one conductive pad arranged in an insulating body and at least one electrical contact arranged opposite the electrically conductive pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.