Drive enclosure with gripping pads
US9082460B2 · kind B2 · utility
1Cited by
2References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2012 |
| Grant date | Jul 14, 2015 |
| Priority date | — |
| Expiry date | May 14, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/181
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Improved electronic device protection enclosures are generally described. In an example, an illustrative apparatus for protecting an electronic device is provided. The apparatus includes a drive enclosure structure, a gripping pad, and a deformation mechanism. The drive enclosure structure includes a sidewall. The gripping pad is located on the sidewall and includes a plurality of angled slots. The deformation mechanism is connected to the sidewall and configured to facilitate selective deformation of the gripping pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.