Three-dimensional integrated circuit which incorporates a glass interposer and method for fabricating the same
US9082764B2 · kind B2 · utility
2Cited by
8References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2013 |
| Grant date | Jul 14, 2015 |
| Priority date | — |
| Expiry date | Jul 23, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A three-dimensional integrated circuit (3D-IC) which incorporates a glass interposer and a method for fabricating the three-dimensional integrated circuit (3D-IC) with the glass interposer are described herein. In one embodiment, the 3D-IC incorporates a glass interposer which has vias formed therein which are not filled with a conductor that allow for precision metal-to-metal interconnects (for example) between redistribution layers. In another embodiment, the 3D-IC incorporates a glass interposer which has vias and has a coefficient of thermal expansion (CTE) that is different than the CTE of silicon which is 3.2 ppm/° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.