Method of manufacturing a substrate having a voltage switchable dielectric material
US9084354B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2012 |
| Grant date | Jul 14, 2015 |
| Priority date | — |
| Expiry date | Jun 29, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for designing a printed circuit board to meet a specification is described. A first voltage switchable dielectric material is placed in apposition with a first copper foil. A second voltage switchable dielectric material is placed in apposition with a second copper foil. An arcuate portion of the first copper foil is placed in apposition with a first side of an aluminum member, an adhesive substance being situated between the first copper foil and the first side of the aluminum member. An arcuate portion of the second copper foil in is placed apposition with a second side of the aluminum member, an adhesive substance being situated between the second copper foil and the second side of the aluminum member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.