Wiring substrate and manufacturing method for wiring substrate
US9084371B2 · kind B2 · utility
0Cited by
12References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2010 |
| Grant date | Jul 14, 2015 |
| Priority date | — |
| Expiry date | Sep 1, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a wiring substrate that is provided with a wiring pattern formed from a metal plate, and an insulation layer as a base material to which the wiring pattern is to be fixed. The wiring pattern has a mounting pad for having electronic parts (11) surface-mounted. Electronic parts are mounted onto the surface of the wiring pattern, by pouring solder into the mounting pad of the wiring pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.