Etching piezoelectric material
US9085152B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
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Key dates
| Filing date | May 12, 2009 |
| Grant date | Jul 21, 2015 |
| Priority date | — |
| Expiry date | Apr 7, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Piezoelectric material is shaped by plasma etching to form deep features with high aspect ratios, and desired geometries.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.