Primer composition
US9085701B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2012 |
| Grant date | Jul 21, 2015 |
| Priority date | — |
| Expiry date | Dec 4, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31935
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A primer coating composition for a metal substrate is described. The primer has a suitable binder and is characterized in that there is at least one semiconductor photocatalyst dispersed throughout the primer coating composition. A process of coating a metal substrate is also described. The invention extends to the use of a semiconductor photocatalyst as a top-coat to primer adhesion promoter or as a primer to top-coat delamination inhibitor in a primer coating composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.