Thermally reversible thermal interface materials with improved moisture resistance
US9085719B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2013 |
| Grant date | Jul 21, 2015 |
| Priority date | — |
| Expiry date | Apr 26, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/32245
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention is directed to a reversibly adhesive thermal interface material for electronic components and methods of making and using the same. More particularly, embodiments of the invention provide thermal interface materials that include a hydrolytically-stable, thermally-reversible adhesive, and a thermally conductive and electrically non-conductive filler, where the thermal interface material is characterized by a thermal conductivity of 0.2 W/m-K or more and an electrical resistivity of 9×1011 ohm-cm or more.The thermally reversible adhesive comprises a functionalized aminopropyl methylsiloxane-dimethylsiloxane copolymer containing a plurality of dienophile functional groups bonded through an imide linkage, preferably maleimide groups, and a crosslinking agent containing a plurality of diene functional group, preferably furan groups. The reactive groups undergo a Diels Alder crosslinking reaction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.