Touch panel and a bonding structure and method thereof
US9087703B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2014 |
| Grant date | Jul 21, 2015 |
| Priority date | — |
| Expiry date | Aug 15, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/041
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A bonding structure includes a first substrate, a second substrate, a printed circuit board (PCB) disposed between the first substrate and the second substrate, anisotropic conductive adhesive (ACA) and conductive wires. The ACA is disposed between second connecting bonding pads of the first substrate and second bonding pads of the second substrate. First bonding pads of the first substrate are bonded with corresponding first matching bonding pads of the PCB, and second duplicated bonding pads of the first substrate are bonded with second matching bonding pads of the PCB, wherein the first and the second matching bonding pads are disposed on the same surface of the PCB. The second connecting bonding pads and the corresponding second duplicated bonding pads are electrically coupled via the conductive wires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.