Power converter package structure and method
US9088215B2 · kind B2 · utility
0Cited by
10References
18Claims
0Family size
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Key dates
| Filing date | Jun 8, 2011 |
| Grant date | Jul 21, 2015 |
| Priority date | — |
| Expiry date | May 21, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment power converter package comprises a semiconductor die, an output inductor, a plurality of input capacitors and output capacitors. The semiconductor die, the output inductor and the plurality of capacitors are mounted on a lead frame and connected one to another through various pads on the lead frame. The semiconductor die comprises a high side switch, a low side switch and a driver. The power converter package is electrically coupled to an external pulse width modulation controller through a variety of input and output pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.