Cooling system for electronics
US9089076B2 · kind B2 · utility
7Cited by
21References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2012 |
| Grant date | Jul 21, 2015 |
| Priority date | — |
| Expiry date | Oct 10, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus and method is provided for conveying heat away from an electronic component. In one embodiment, a method positions a conformable thermal interface element in heat conducting contact with an electronic component. A heat conducting member is disposed within the conformable thermal interface element. The heat conducting member is coupled with a manifold so that the heat conducting member is in heat conducting contact with the manifold. The electronic component may be installed or removed without disassembly of the apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.