Forming feedthroughs for hermetically sealed housings using two-material powder injection molding
US9089715B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2010 |
| Grant date | Jul 28, 2015 |
| Priority date | — |
| Expiry date | Feb 27, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2235/6022
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Methods of forming a feedthrough using a mold that defines a cavity when closed and includes one or more cores configured to move in and out of the mold cavity. The methods include injecting non-electrically conductive powder injection molding (PIM) feedstock into the mold cavity to form an insulative body around a portion of each of the cores disposed in the mold cavity, removing each of the cores from the insulative body to form one or more core cavities in the insulative body, injecting electrically conductive PIM feedstock into the core cavities to form one or more conductors in the core cavities, respectively, and sintering the insulative body and the conductors to form the feedthrough.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.