Method for cleaning a nozzle of a material deposition system
US9089863B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2012 |
| Grant date | Jul 28, 2015 |
| Priority date | — |
| Expiry date | Mar 10, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/081
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for cleaning a nozzle of a material deposition system configured to deposit material on an electronic substrate includes: performing a deposition operation with a material deposition system configured to position an electronic substrate under a deposition head movable by a gantry, to supply material to a chamber of the deposition head, to extend a piston of the deposition head from the chamber, the needle terminating in a needle orifice, and to push a volume of material out of the chamber by an actuator of the deposition head to form a desired volume of material at the needle orifice that is deposited on the electronic substrate; and cleaning the needle orifice with air directed to the needle orifice.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.