Patent · US Active

Process monitoring the processing of a material

US9089926B2 · kind B2 · utility

4Cited by

8References

16Claims

0Family size

Assignee

TRUMPF Werkzeugmaschinen GmbH + Co. KG · DE

Inventors

Dieter Pfitzner · Weil der Stadt, DE
Tim Hesse · Ditzingen, DE
Winfried Magg · Ditzingen, DE

Key dates

Filing date	Nov 4, 2006
Grant date	Jul 28, 2015
Priority date	—
Expiry date	Nov 5, 2030

Classification

Technology area (CPC G)Physics
CPC primaryG01J2005/0077
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method for monitoring a processing region of a workpiece on which laser processing is being carried out, in which method the radiation emitted by the processing region is detected by a detector system in a space-resolved manner, wherein the radiation of the processing region is detected for each elemental area of the processing region imaged onto the detector system at least two wavelengths simultaneously. Accurate process monitoring may thereby be carried out.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.