Device for cutting a substrate and method for controlling such a cutting device
US9089994B2 · kind B2 · utility
3Cited by
5References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 9, 2015 |
| Grant date | Jul 28, 2015 |
| Priority date | — |
| Expiry date | Feb 9, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/7755
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A device for cutting a substrate along a cutting line is disclosed. The device includes a saw unit with a saw blade, which can be rotated around an axis of rotation, a guide carriage for moving the saw unit along a guide rail, and a control device for controlling the saw unit and the guide carriage. A marking device is provided for marking an end point of the cutting line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.