In situ oxide removal, dispersal and drying for silicon SiO2
US9090475B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 6, 2010 |
| Grant date | Jul 28, 2015 |
| Priority date | — |
| Expiry date | Feb 1, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2916
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of removing silicon-dioxide from silicon powder. The method comprises: providing a silicon powder defined by each particle having a silicon core and a silicon dioxide layer surrounding the silicon core; dispersing the particles in a dispersing solution; adding an etching solution, wherein the etching solution removes the silicon dioxide layer; adding an organic solvent, thereby producing an organic phase and an aqueous phase, the organic phase comprising the silicon cores and the organic solvent, and the aqueous phase comprising the dispersing solution, the etching solution, and the etching by-products; coating each silicon core with an organic material; draining out the aqueous phase; washing the organic phase, wherein the remaining material from the aqueous phase is removed; and providing the silicon powder as a plurality of silicon cores each absent a silicon dioxide layer and having an organic coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.