Patent · US Active

Polyamide and polyamide composition

US9090739B2 · kind B2 · utility

1Cited by

11References

17Claims

0Family size

Assignee

ASAHI KASEI CHEMICALS CORPORATION · JP

Inventors

Shinji Ieda · Tokyo, JP
Kazunori Terada · Tokyo, JP
Yu Nitto · Tokyo, JP

Key dates

Filing date	Mar 14, 2012
Grant date	Jul 28, 2015
Priority date	—
Expiry date	Mar 14, 2032

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L77/06
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

(Problems to be solved)Provision of a polyamide composition with good heat resistance, stability under heating, heat resistant color tone stability, reflow heat resistance properties and fogging properties.(Solution)A polyamide obtained by polymerizing (a) a dicarboxylic acid containing at least 50 mol % of an alicyclic dicarboxylic acid and (b) a diamine containing at least 50 mol % of a diamine having a pentamethylenediamine skeleton,

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.