Radiator systems
US9091489B2 · kind B2 · utility
5Cited by
38References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 2011 |
| Grant date | Jul 28, 2015 |
| Priority date | — |
| Expiry date | Nov 12, 2033 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2275/06
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A system of spacecraft radiators comprising pre-formed thermal-transfer modules joined together by at least one solid-state welding process. Critical failure points are eliminated by forming the thermal-transfer modules as a single unitary piece, preferably by an extrusion process. The thermal-transfer modules allow the formation of larger radiator assemblies, which may comprise a wide range of sizes and physical geometries.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.