Method of producing an optoelectronic semiconductor chip, and such a semiconductor chip
US9093604B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Oct 21, 2011 |
| Grant date | Jul 28, 2015 |
| Priority date | — |
| Expiry date | Oct 21, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/882
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of producing an optoelectronic semiconductor chip having a semiconductor layer stack based on a material system AlInGaP includes preparing a growth substrate having a silicon surface, arranging a compressively relaxed buffer layer stack on the growth substrate, and metamorphically, epitaxially growing the semiconductor layer stack on the buffer layer stack, the semiconductor layer stack having an active layer that generates radiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.