LED module, method for manufacturing the same, and LED channel letter including the same
US9093615B2 · kind B2 · utility
2Cited by
0References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2012 |
| Grant date | Jul 28, 2015 |
| Priority date | — |
| Expiry date | Oct 21, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a method for manufacturing a light emitting diode (LED) module, the method including: disposing a circuit board at a molding space formed by an upper mold and a lower mold; adding a filling material to the molding space; hardening the filling material to form a molding cover covering at least a portion of an upper surface, a lower surface, and a side surface of the circuit board, the molding cover having an opening exposing the lower surface of the circuit board; removing the upper mold and the lower mold from the circuit board; and disposing an LED on the upper surface of the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.