Molded package for light emitting device
US9093621B2 · kind B2 · utility
3Cited by
0References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2012 |
| Grant date | Jul 28, 2015 |
| Priority date | — |
| Expiry date | Dec 27, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/882
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides a molded package for a light emitting device including a molded resin and first and second leads, the exposed surface of the first lead having a first and second edge portions opposed to each other so as to put a mounting area therebetween in a first direction, the first and second edge portions respectively having one first cutout and second cutouts, the mounting area having a size not less than a distance between the first and the second cutouts and less than a distance between the first the second edge portions in the first direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.