Method for coating an optoelectronic chip-on-board module and optoelectronic chip-on-board module
US9093622B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2011 |
| Grant date | Jul 28, 2015 |
| Priority date | — |
| Expiry date | Sep 12, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0362
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method is provided for coating an optoelectronic chip-on-board module, including a flat substrate populated with one or more optoelectronic components, having a transparent, UV-resistant, and temperature-resistant coating made of one or more silicones. A corresponding optoelectronic chip-on-board module and a system having multiple optoelectronic chip-on-board modules are also provided. The method includes the following steps: a) preheating the substrate to be coated to a first temperature; b) applying on the preheated substrate a dam that encloses a surface area or partial area of the substrate to be coated, the dam being made of a first, heat-curable, highly reactive silicone that cures at the first temperature; c) filling the surface area or partial area of the substrate enclosed by the dam with a liquid second silicone; and d) curing the second silicone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.