Method for manufacturing printed circuit board
US9095064B2 · kind B2 · utility
0Cited by
12References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2012 |
| Grant date | Jul 28, 2015 |
| Priority date | — |
| Expiry date | Jan 29, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1034
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A base insulating layer is formed on a suspension body, and write wiring traces and read wiring traces are formed on the base insulating layer. The write wiring trace and the read wiring traces are formed on a body region of the base insulating layer, and the write wiring trace is formed on an auxiliary region of the base insulating layer. The base insulating layer is bent along a bend portion. This causes the write wiring trace to be positioned above the write wiring trace.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.