Enclosure for electronic components with enhanced cooling
US9095075B2 · kind B2 · utility
1Cited by
20References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 27, 2012 |
| Grant date | Jul 28, 2015 |
| Priority date | — |
| Expiry date | Oct 5, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/206
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An enclosure is provided and includes a frame defining an interior and a pathway, the frame being configured to prevent external air infiltration to the interior, a divider disposed to divide the interior into first and second chambers that are each fluidly communicative with the pathway and a blower including a cold-plate configured to cool first electronic components disposed on the cold plate, second electronic components disposed in the second chamber and third electronic components disposed in the first chamber by cycling air through the first chamber, the second chamber and the airflow pathway.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.