Micro pick up array mount with integrated displacement sensor

US9095980B2 · kind B2 · utility

Assignee

• LuxVue Technology Corporation · US

Inventors

• Dariusz Golda · Portola Valley, US
• John A. Higginson · Santa Clara, US
• Andreas Bibl · Los Altos, US
• Paul Argus Parks · Austin, US
• Stephen P. Bathurst · Lafayette, US

Key dates

• Filing date: Feb 25, 2013
• Grant date: Aug 4, 2015
• Expiry date: Sep 21, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/7598
• WIPO field: Handling
• WIPO sector: Mechanical engineering

Abstract

Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.