Method for forming a polymer part
US9096009B2 · kind B2 · utility
2Cited by
75References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2008 |
| Grant date | Aug 4, 2015 |
| Priority date | — |
| Expiry date | Dec 4, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/7393
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Various systems and methods for forming a polymer part with utilizing heating fluid are provided. In one embodiment of the present invention a method for forming polymer includes heating the mold apparatus with a first heat energy source comprising heating fluid to a first mold temperature, and then heating the mold apparatus with a second energy source which is different than the first energy source. The second energy source heats the mold surface to a second mold temperature greater than the first mold temperature to form the part to achieve a desired surface finish of the polymer part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.