Adhesive dispensing profile enhancement
US9096026B2 · kind B2 · utility
11Cited by
4References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2012 |
| Grant date | Aug 4, 2015 |
| Priority date | — |
| Expiry date | Apr 12, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B7/025
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A first method is provided that comprises the steps of: measuring a first surface disposed on a first substrate, measuring a second surface disposed on a second substrate, calculating a variable gap between the first surface and the second surface, depositing a variable amount of adhesive on the first surface of the first substrate based at least in part on the calculation of the variable gap, and placing the second substrate over the first substrate, wherein the adhesive is disposed between the first surface of the first substrate and the second surface of the second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.