Downhole tool thermal device
US9097088B2 · kind B2 · utility
1Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2011 |
| Grant date | Aug 4, 2015 |
| Priority date | — |
| Expiry date | Aug 11, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
Subterranean devices are provided that are configured or designed for high temperature downhole use. The downhole devices comprise an electronic device configured or designed for downhole use in the well and a heat dissipation system. The heat dissipation may include one or more active coolers and a micro-particulate radiation improving coating applied to the active cooler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.