System and method for remote temperature sensing with routing resistance compensation
US9098097B2 · kind B2 · utility
2Cited by
5References
19Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 13, 2013 |
| Grant date | Aug 4, 2015 |
| Priority date | — |
| Expiry date | Dec 22, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K7/01
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An integrated circuit die includes multiple temperature sensor units each for measuring the temperature of respective regions of a semiconductor substrate of the integrated circuit die. The temperature sensor units are each coupled to a multiplexer by respective groups of signal lines. The signal lines include resistance compensation areas for maintaining a particular ratio of resistances of the signal lines of each group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.