Sintered backside shim in a press pack cassette
US9099316B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2013 |
| Grant date | Aug 4, 2015 |
| Priority date | — |
| Expiry date | Oct 30, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13055
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Within a cassette of a press pack module, a conductive shim is bonded to the backside of a device die by a layer of sintered metal. The die, sintered metal, and shim together form a sintered assembly. The cassette is compressed between a metal top plate member and a metal bottom plate member such that the backside of the assembly is pressed against the top plate member, and such that the frontside of the assembly is pressed against another shim. A central portion of the frontside surface of the die is contacted on the bottom by the other shim, but there is no shim contacting a peripheral portion of the frontside surface. Despite there being no shim in contact with the peripheral portion of the frontside surface, the peripheral portion is in good thermal contact with the top plate member through the sintered metal and the bonded conductive shim.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.