Trench-assisted thermoelectric isothermalization of power switching chips
US9099426B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2012 |
| Grant date | Aug 4, 2015 |
| Priority date | — |
| Expiry date | May 12, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
One embodiment includes a power module. The power module includes a power switching device, at least one spot cooler and a base cooler. The at least one spot cooler and base cooler are configured to lower an average surface junction temperature and to isothermalize the surface junction temperature of the power switching device. The at least one spot cooler is embedded in at least one of a heat sink base or base cooler of the power module, and the at least one of the heat sink base or base cooler are attached onto a double side metalized substrate that is attached to the power switching device. In one embodiment, the power module further includes a trench structure cut into the double side metalized substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.