Image sensor with a curved surface
US9099604B2 · kind B2 · utility
39Cited by
8References
27Claims
0Family size
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Key dates
| Filing date | Apr 8, 2013 |
| Grant date | Aug 4, 2015 |
| Priority date | — |
| Expiry date | Apr 12, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8023
Abstract
A method for manufacturing an image sensor, including the successive steps of: forming columns of a semiconductor material; forming one or several pixels at a first end of each of the columns; and deforming the structure so that the second ends of each of the columns come closer to each other or draw away from each other to form a surface in the shape of a polyhedral cap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.