Apparatus for thermal melting process and method of thermal melting process
US9101995B2 · kind B2 · utility
0Cited by
10References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 12, 2014 |
| Grant date | Aug 11, 2015 |
| Priority date | — |
| Expiry date | Sep 12, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Provide is an apparatus for thermal melting processes that is capable of directly cooling the process object without requiring a separate cooling plate.The apparatus for thermal melting process according to the present invention is an apparatus 1 for thermal melting process that thermally melts objects 100 including solder in an atmosphere containing carbonic acid vapor, and the hand part 4 for carrying and transferring the thermally melted process objects 100 is used as a cooling plate as well.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.