Debris minimization and improved spatial resolution in pulsed laser ablation of materials
US9102008B2 · kind B2 · utility
1Cited by
23References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2008 |
| Grant date | Aug 11, 2015 |
| Priority date | — |
| Expiry date | Jan 29, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of minimizing the deposition of debris onto a sample being ablated. The method comprises: 1) reducing a laser pulse energy to approximately a threshold level for ablation; 2) focusing the energy using an immersion object lens having a final element and 3) ablating a region of the sample using a multitude of laser pulses, each pulse being sufficiently separated in time to reduce a concentration of ablation products in a gas phase.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.