Modular insulated tie plate
US9103074B1 · kind B1 · utility
2Cited by
11References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2012 |
| Grant date | Aug 11, 2015 |
| Priority date | — |
| Expiry date | Sep 2, 2033 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE01B2205/00
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A tie plate assembly including a tie plate, an insulator plate assembly, and first and second clips configured to secure a rail to the tie plate assembly. The tie plate has a body with a top surface and the insulator plate assembly is positioned on the top surface of the tie plate. The insulator plate assembly includes a top pad and an abrasive plate. The first and second clips comprise an electrically-insulating material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.