Sensor assembly
US9103930B2 · kind B2 · utility
5Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 2012 |
| Grant date | Aug 11, 2015 |
| Priority date | — |
| Expiry date | Aug 27, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A multiple axis sensor assembly includes an enclosure and encapsulated microelectromechanical system (MEMS) sensors. The encapsulated sensors are disposed inside the enclosure and are mounted in different orientations, which correspond to different axes of the sensor assembly. A controller of the sensor assembly is disposed in the enclosure and electrically coupled to the MEMS sensors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.