Heat dissipating module and computer using same
US9104388B2 · kind B2 · utility
1Cited by
2References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 3, 2013 |
| Grant date | Aug 11, 2015 |
| Priority date | — |
| Expiry date | Dec 6, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat dissipating module includes a heat sink and an aerofoil deflector above the heat sink. The heat sink has an upper surface corresponding to the camber of the deflector, to increase the speed and efficiency of a cooling airflow passing therethrough, the airflow generated by a fan.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.