Barrel-plating quad flat no-lead (QFN) packaging structures and method for manufacturing the same
US9105622B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 2014 |
| Grant date | Aug 11, 2015 |
| Priority date | — |
| Expiry date | May 6, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A barrel-plating quad flat no-lead (QFN) package structure and a method for manufacturing the same. The method includes: providing a metal substrate for a plurality of QFN components; forming a first photoresist film on a top surface of the substrate; forming a plating pattern in the first photoresist film; forming a first metal layer containing a plurality of inner leads; etching the substrate from the back surface of the substrate to form a plurality of I/O pads; filling sealant in the etched areas; attaching at least one die in a predetermined region on the top surface of the substrate; connecting the die and the inner leads using metal wires; sealing the die, the inner leads, and the metal wires with a molding compound; separating the resulting joint QFN components into individual QFN components; and forming a second metal layer on the back surface of the I/O pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.