Method for making an electronic apparatus having an encapsulating layer within and outside of a molded frame overlying a connection arrangement on a circuit board

US9105819B2 · kind B2 · utility

Assignee

• ABL IP Holding LLC · US

Inventors

• Daniel Vincent Sekowski · Loganville, US
• Frederick Lloyd Carpenter · Conyers, US
• Mark Anthony Hand · Covington, US
• Bernhard Bachl · Regensburg, DE
• Bernd Bienek · Oberhausen, DE
• Olaf Cladders · Kamp-Lintfort, DE
• Henning Dieker · Meerbusch, DE
• Christian Miesner · Tönisvorst, DE
• Lothar Schopmann · Kamp-Lintfort, DE
• Herfried Zimmer · Oberhausen, DE

Key dates

• Filing date: Apr 18, 2012
• Grant date: Aug 11, 2015
• Expiry date: Jan 31, 2034

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49172
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

In an electronic apparatus comprising a circuit board supporting semiconductor components and traces or conductors for supplying electrical energy to the semiconductor components, and a connection arrangement by which the conductors are connected to a power supply cable, the circuit board being covered by an electrically insulating encapsulating layer, a molded frame part is mounted on the circuit board so as to cover the connection arrangement, the molded frame part having a circumferential edge structure which extends on one end into the encapsulating layer and at the other end projects above the encapsulating layer so as to create an interior space which, when the encapsulating layer is at least partially cured, is filled with additional encapsulating compound to form, after curing, a relatively thick protective layer over the wire or cable and conductor connecting area.