Method for forming a patterned layer on a substrate
US9105867B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2008 |
| Grant date | Aug 11, 2015 |
| Priority date | — |
| Expiry date | Oct 12, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/821
Abstract
This invention relates to a method for forming a patterned layer on a substrate by means of an imprint process. According to the method a first layer is provided on the substrate, and a pattern of recesses is provided in the first layer by imprinting the layer with a patterning means. Then the first layer is cured. The curing is followed by performing a first surface treatment onto the first layer to make the surface of thereof hydrophilic, and then performing a second surface treatment onto a selected subarea of the surface of the first layer to make the. subarea hydrophobic. The subarea includes surface portions between the recesses and excludes the recesses. Finally, a conducting pattern material (41) is deposited into the recesses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.