Silicon condenser microphone
US9107009B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 26, 2013 |
| Grant date | Aug 11, 2015 |
| Priority date | — |
| Expiry date | Oct 26, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49005
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A silicon condenser microphone is disclosed. The microphone includes a transducer, an IC chip, a first board, a second board spaced from the first board by a frame, and a third board located between the first board and the second board. A cavity is accordingly formed by the first board, the frame and the third board to accommodate the transducer and the IC chip. The IC chip is electrically connected to a surface of the third board facing the second board. The microphone provides an enlarged back volume to the transducer and provides the transducer with a shield against electro-magnetic interference. A manufacturing process is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.