Electronics enclosures with high thermal performance and related system
US9107293B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 2012 |
| Grant date | Aug 11, 2015 |
| Priority date | — |
| Expiry date | Nov 2, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20645
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Various apparatuses, methods, and systems are provided for cooling electronic components. For example, an apparatus includes an electronics enclosure having multiple ribs configured to separate electronic components. The apparatus also includes at least one fluid transport structure encased within the electronics enclosure. Each fluid transport structure includes multiple pipes and multiple flow channels. The flow channels are located within the ribs of the electronics enclosure, and the pipes are configured to transport cooling fluid to and from the flow channels. The fluid transport structure(s) and the electronics enclosure are formed from different materials. The at least one fluid transport structure can be resistant to corrosion caused by the cooling fluid, and the electronics enclosure can be susceptible to corrosion caused by the cooling fluid. As an example, the at least one fluid transport structure could consist essentially of nickel, and the electronics enclosure could consist essentially of aluminum.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.