Patent · US Active

Multilayer printed circuit board and device comprising the same

US9107295B2 · kind B2 · utility

2Cited by

19References

19Claims

0Family size

Assignee

ZF FRIEDRICHSHAFEN AG · DE

Inventors

Wilfried Lassmann · Hirschau, DE
Christian Büttner · Pegnitz, DE

Key dates

Filing date	Dec 10, 2012
Grant date	Aug 11, 2015
Priority date	—
Expiry date	Nov 14, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH05K5/0026
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A multilayer printed circuit board may comprise at least one printed circuit board front end that is thermally conductively metalized. An apparatus with such a printed circuit board is also proposed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.